SMC04RD
1.27mm Pitch Male Dual Row Board to Board Connector Vertical SMT Type w/ Board lock Dip Type ( Har-Flex )
Specification
Insulator Material: High Temp. Thermoplastic, UL94V-0.
Contact Material: Phosphor Bronze.
Board Lock Material: Brass.
Contact Plating: Au (14µ" / 5µ" / 30µ" Min.) on Contact Area. Au (1µ" Min.) or Sn (100µ" Min.) on Soldertail. Nickle (Contact-80µ" Min. / Soldertail -50µ" Min.)
Board Lock Plating: Sn(100µ" Min.) over Nickel (40µ” Min.)
Current Rating: 1.7A Max.
Contact Resistance: 25 Milliohms Max.
Insulator Resistance: 1000 Megohms Min.
Dielectric Withstanding: 500V DC for 1 Minute.
Operating Temperature: -55°C ~ +125°C.
Max. Processing Temp.: 230°C for 30-60 seconds. 260°C for 10 seconds.