Contact Plating: Au on Con tact Area. Sn (100µ''Min.) on Soldertail. Nickle (Contact - 80µ" Min./ Soldertail - 50µ''Min.) Board Lock Plating: Sn(100µ''Min.) over Nickel (40µ''Min.)
Current Resistance: 5A Max
Contact Resistance: 25 Milliohms Max.
Insulator Resistance: 1000 Megohms Min.
Dielectric Withstanding: 500V AC for 1 Minute.
Operating Temperature: -55℃ ~ +125℃
Max. Processing Temp.: 230℃ for
30~60 seconds
260℃ for 10 seconds